11:30 am - 12:15 pm
Join the webinar showcasing GENOA 3DP’s newest capabilities: TMg and Path Coverage. Attendees will learn how the ‘simulate to print’ tool-set allows engineers to accurately predict voids, deflection, net-shape, residual stress, crack growth and other anomalies associated with as-built AM parts for metal, polymer and ceramic materials. Specifically, learning about visualizing problematic regions of the printer path and printed parts to address defects head on. This webinars will demonstrate how GENOA 3DP’s seamless user interactivity, robust capabilities, and accuracy down to the micro-scale will assist in improving part quality, reducing scrap rate, engineering time and meeting specs.